Chiplet System is a high-performance semiconductor architecture designed for those who value scalability and technical efficiency. It features a disaggregated System-in-Package design where functional blocks like compute cores and I/O are produced as independent dies, engineered to optimize performance using the most effective process nodes. This multi-functional system heterogeneously integrates chiplets onto a common interposer, facilitating high-density routing and seamless data flow via standardized protocols like UCIe. Whether you require 2.5D or 3D stacking for superior power efficiency,this architecture delivers a reliable, verified environment through known-good-die methodology.